Joel Wells of ApplyIR and Ross Overstreet of FLIR Systems will be on campus January 25th, 2017 demonstrating a variety of Science grade thermal imaging cameras for use in a variety of different applications.
Please join us and explore how infrared technology can be used to provide non-contact temperature measurement and thermal characterization relevant to a wide range of applications. Next-generation FLIR camera systems provide extraordinary capability from general purpose temperature measurement to infrared microscopy down to 3.5um/pixels or high speed thermal events at 1000 frames/sec.
We’ll discuss infrared techniques used to conquer common temperature measurement challenges. Plus we’ll give you a first-hand look at the new capabilities of calibrated IR cameras and show you how to get the most out of a thermal imaging solution.
DISCUSSION TOPICS INCLUDE:
- Review of theories behind infrared thermography and heat transfer basics
- Compare Thermal and Photon-counting IR camera technologies and how they measure temperature
- Discuss the effects of emission, reflection, and transmission on measurements
APPLICATIONS REVIEW:
- Electrical Engineering: Micro-electronics / PCB Inspection, Characterization & Failure Analysis
- Civil Engineering: Bridge De-lamination, NDT on composite materials
- Bio-Medical Engineering: Medical Device characterization
- Mechanical Engineering: Friction analysis, Materials testing, etc
- Medical: Blow flow analysis, Brown fat studies, etc
- General: Anything that could benefit from non-contact temperature measurement
Register here: https://www.eventbrite.com/e/flir-research-and-science-thermal-camera-seminar-at-ucsd-tickets-31103728088